• 焊接贴装
• SMT (BGA, uBGA, PoP and 01005, 008004)
• BGA/CSP/CBGA/CCGA/PGA down to 0.27mm
• COB, PoP, Multichip, Chip on FPC
• Soldering & Flip Chip with die size of 0.5~50mm 焊接/倒装芯片的芯片尺寸在0.5~50mm
• 焊接贴装
• SMT (BGA, uBGA, PoP and 01005, 008004)
• BGA/CSP/CBGA/CCGA/PGA down to 0.27mm
• COB, PoP, Multichip, Chip on FPC
• Soldering & Flip Chip with die size of 0.5~50mm 焊接/倒装芯片的芯片尺寸在0.5~50mm
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